Adom Chip Laser
Public Made by Adomby adom
Laser-etch a component's MPN into its CAD at the STEP layer — so the downloadable STEP, a Fusion import, and the 3D model all carry the part number on the die. A callable HTTP service; output is a STEP file.
Side-wall etch option: parts with optical windows or a grille on top (ToF modules) must be marked on the side, not the die top
Summary
adom-chip-laser etch and POST /etch?mpn= always place the mark on the die TOP. For parts whose top carries the function (ToF modules with emitter/receiver windows and a gate grille: VL53L5CX / VL53L7CX / VL53L8CX; camera modules; any lensed sensor) a top mark destroys the 3D view, and the shared wiki-component skill already says such parts must be marked on a clear side wall. There is no way to ask for that today.
Request
- Add
?surface=top|side:-y|side:+y|side:-x|side:+x(CLI:--surface) to choose the wall; keep the same light-grey inlay body approach so it survives STEP -> GLB and Fusion import. - Auto-detect a busy top (recessed windows / lenses / grille occupying more than a small fraction of the top face) and default to
side:-yfor those, reporting the chosen surface in the response so the AI can revise. - Size the mark to the wall height (about 0.55 x wall height, capped by wall length / character count) and centre it on the wall.
Reference
Side-etched STEPs produced for the three ToF pages with an XCAF script (light-grey inlay, 0.03 mm proud, -y wall, 0.8-0.9 mm text) are attached to adom/vl53l5cx, vl53l7cx and vl53l8cx as <MPN>-etched.step; happy to hand the placement code over.