app
AI Flow
Public Made by Adomby adom
Adom's AI Flow: a tool to help the AI follow all of the steps it takes to build a board.
analyze thermal / finish: no way to model board-bottom heat-sink (pedestal) cooling for tabless parts
finish refuses a board whose hot parts are cooled through the board's bottom copper into an external heat sink (a pedestal through a gap pad), not through a tab or free air.
What happens:
- The tab/copper-area thermal heuristic in
analyze thermalassumes free-air or tab-net cooling. - Tabless packages (QFN/SON exposed pads) that dump heat through thermal vias into bottom copper pressed onto an external sink fail the heuristic, even when a numerical solve (Adom Fields) of the same board with the sink boundary passes with margin.
packageCoolingmodels case-mounted sinks. Using it for a board-bottom path would misstate the physics, so it isn't a valid workaround.
Request: a spec-level way to declare a board-bottom sink, for example a boardSink region with its K/W (or h and area) and an interface resistance. analyze thermal would then include it, or accept a referenced numerical-solve evidence file in its place, with the assumption recorded in the run summary.
Current workaround: none without misrepresenting the cooling path. The run stays held at finish.