AI Flow
Public Made by Adomby adom
Adom's AI Flow: a tool to help the AI follow all of the steps it takes to build a board.
Thermal-via planner mistakes remote same-net pours for local heat-spreading copper
AIFlow 0.1.70, source 706d95235c7e67f56b7bd4771fc051c4b19e4630; KiCad 10.0.5 / bridge 1.0.55 on Windows, Adom Bridge 2.1.172.
On the electronic-load run, describe the accepted local LOAD_POS diode regions on F.Cu and B.Cu, then run thermal-vias plan. It proposes 16 vias beside Q1 even though these copper regions are only around D1, elsewhere on the board. The exact output is Q1 LOAD_POS target 16 existing 0 planned 16. No proposed vias were landed.
The planner tests only net-wide presence of both layer names, not the candidate location. It also offers rings beyond the 3 mm radius used by its post-landing count. Expected: require local region coverage on both layers and use the same neighbourhood for planning and acceptance. Native filled connectivity and thermal checks must remain mandatory; planned polygons alone are not proof of heat flow.
A focused fix and regressions are in progress against the current immutable HEAD, covering remote/disjoint regions, via-edge coverage, malformed geometry, and plan/readback-count consistency. The external TO-220 heatsink design remains an independent unresolved engineering issue.